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Invention Publication
CN110620098A 包括壳体的功率半导体器件及生产功率半导体器件的方法 有权

包括壳体的功率半导体器件及生产功率半导体器件的方法
Abstract:
本发明涉及包括壳体的功率半导体器件及生产功率半导体器件的方法，该功率半导体器件包括穿过壳体开口的销元件；包括弹性密封装置，其布置在壳体的壳体开口壁与销元件之间，该壳体开口壁限定壳体开口并且环绕销元件；并包括套筒，其中销元件延伸穿过套筒并延伸穿过密封元件的密封装置开口，其中密封装置未以材料结合的方式连接到套筒、连接到壳体开口壁和连接到销元件，且密封装置将壳体开口壁与套筒封隔开来并且将套筒与销元件封隔开来；并包括布置在密封装置上的交联灌封化合物，其中交联灌封化合物以材料结合的方式连接到套筒、连接到壳体开口壁和连接到销元件，且灌封化合物将壳体开口壁与套筒封隔开来并且将套筒与销元件封隔开来。
Abstract(English):

The invention relates to a power semiconductor device having a pin element which passes through a housing opening, an elastic sealing device which is arranged between a housing opening wall of the housing, where the housing opening wall delimits the housing opening and encircles the pin element. The pin element runs through the sleeve and through a sealing device opening of the sealing element. The sealing device is not connected in a materially bonded manner to the sleeve, to the housing opening wall and to the pin element and the sealing device seals off the housing opening wall from the sleeve and seals off the sleeve from the pin element. A crosslinked potting compound is arranged on the sealing device. The crosslinked potting compound is connected in a materially bonded manner to thesleeve, to the housing opening wall and to the pin element and the potting compound seals off the housing opening wall from the sleeve and seals off the sleeve from the pin element.

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