The invention relates to an electronic potting glue melting device. The electronic potting glue melting device comprises a melting mechanism. The melting mechanism comprises electromagnetic inductionheating units and a mounting member which makes an iron drum with solid electronic potting adhesive be inverted. Each electromagnetic induction heating unit comprises an electromagnetic induction heating cover. Each electromagnetic induction heating cover comprises an isolation cover and an electric coil wound around the inner wall of the isolation cover. The electromagnetic induction heating cover is downwardly moved and arranged on the iron drum in a sleeving manner to heat the electronic potting adhesive in the iron drum or the electromagnetic induction heating cover moves upward away fromthe iron drum after the heating is ended. By the adoption of the electromagnetic induction heating cover, the self-heating of the heated object (iron drum) can be realized, the electromagnetic induction heating cover has the beneficial effects of short preheating time and high heating speed and meanwhile has the thermal insulation effect, so that the working environment at the production site is greatly improved; and the automation of the melting process of the electronic potting adhesive before potting is achieved.