知搜-全球专利检索

  1. 登录
  2. 注册
发明公开
CN109904298A LED封装结构及其制备方法，以及LED灯 有权

LED封装结构及其制备方法，以及LED灯
摘要：
本发明公开了一种LED封装结构，包括杯状支架、LED芯片、隔离粉体层、金属层和封装胶，所述杯状支架包括基板和侧壁，所述侧壁和所述基板共同形成所述杯状支架的空腔，所述金属层、所述隔离粉体层和所述LED芯片设置在所述空腔中，所述金属层设置在所述基板表面，所述LED芯片固定在所述金属层上，所述隔离粉体层至少设置在所述金属层上未设置有所述LED芯片的区域，所述隔离粉体层包括隔离粉体，所述封装胶填充在所述空腔中，覆盖所述LED芯片和所述隔离粉体层。本发明还公开了一种LED封装结构的制备方法及一种LED灯。
摘要（英）：

The invention discloses an LED packaging structure. The LED packaging structure comprises a cup-shaped support, an LED chip, an isolation powder layer, a metal layer and a packaging adhesive, whereinthe cup-shaped support comprises a substrate and side walls, the side walls and the substrate jointly form a cavity of the cup-shaped support, the metal layer, the isolation powder layer and the LED chip are arranged in the cavity, the metal layer is arranged on the surface of the substrate, the LED chip is fixed to the metal layer, the isolation powder layer is at least arranged in a region, where the LED chip is not arranged, of the metal layer, the isolation powder layer comprises isolation powder, the cavity is filled with the packaging adhesive, and the packaging adhesive covers the LED chip and the isolation powder layer. The invention furthermore discloses a preparation method of the LED packaging structure and an LED lamp.

公开/授权文献
0/0