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CN109712959A MEMS与IC装置的单块整合 有权 转让

MEMS与IC装置的单块整合
摘要：
本申请涉及MEMS与IC装置的单块整合，揭示一种具有微机电系统(MEMS)与集成电路(IC)的整合型单块装置及其形成方法。该单块装置包括在该IC上方形成有IC组件及MEMS的衬底。该衬底上方形成在接垫阶中具有IC互连垫的后段(BEOL)介电质。具有所述IC互连垫的该BEOL介电质上方形成MEMS。该MEMS包括MEMS堆栈，该MEMS堆栈具有主动MEMS层、及在该主动MEMS层的顶端与底端表面上形成的图案化顶端与底端MEMS电极。形成至少部分地穿过该主动MEMS层的IC MEMS接触贯孔。IC MEMS接触形成于该主动MEMS层中的所述IC MEMS接触贯孔中，并且组配成耦接至所述IC互连垫。
摘要（英）：

An integrated monolithic device with a micro-electromechanical system (MEMS) and an integrated circuit (IC) and a method of forming thereof is disclosed. The monolithic device includes a substrate with IC components and a MEMS formed over the IC. A back-end-of-line (BEOL) dielectric having IC interconnect pads in a pad level is formed over the substrate. A MEMS is formed over the BEOL dielectric with the IC interconnect pads. The MEMS includes a MEMS stack having an active MEMS layer and patterned top and bottom MEMS electrodes formed on the top and bottom surfaces of the active MEMS layer. ICMEMS contact vias are formed at least partially through the active MEMS layer. IC MEMS contacts are formed in the IC MEMS contact vias in the active MEMS layer and configured to couple to the IC interconnect pads.

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