The invention is entitled copper foil and copper-clad laminate comprising same. The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is characterized in that when the characteristics of the adhesive surface of the copperfoil are expressed using the number Wn of waves and roughness motif mean depth R which are calculated from a roughness motif determined by a motif method defined by JIS B0631:2000, the number Wn of waves is 11-30 per mm and the roughness motif mean depth R is 0.20-1.10 [um]m.