The invention discloses automatic film attaching equipment. The automatic film attaching equipment comprises a rack, a first feeding assembly, a second feeding assembly, a carrying assembly, a jackingassembly and a film attaching assembly, wherein the first feeding assembly, the second feeding assembly, the carrying assembly, the jacking assembly and the film attaching assembly are arranged on the rack; the first feeding assembly is used for conveying a wafer ring to a transfer station; the second feeding assembly is used for conveying a PCB carrying a microphone to the transfer station, andthe side, provided with sound holes, of the PCB faces downwards; the carrying assembly is located above the transfer station and is used for conveying the wafer ring and the PCB between the transfer station and a film attaching station; the jacking assembly is used for jacking the wafer ring and the PCB on the transfer station, attaching the wafer ring and the PCB to the lower end face of the carrying assembly, and lowering a film-attached finished product attached to the lower end face of the carrying assembly onto the transfer station; and the film attaching assembly is arranged on the rackin a sliding fit mode and is used for carrying out film attaching below the water ring and the PCB in the moving process.