The invention belongs to the technical field of circuit board processing, and provides a soldering method for an axial packaging component, which comprises: processing the axial packaging component toobtain a patch type axial packaging component according to a circuit design requirement; slotting under the patch type axial packaging component to form a fixing groove and fix the axial packaging component in the fixing groove; disposing a pad at the pin of the patch type axial packaging component on a circuit board; disposing a patch type component and the patch type axial packaging component on the same surface of the circuit board to obtain a mounting board; and soldering the mounting board by a SMT soldering apparatus. The axial packaging component and the patch type component are disposed on the same surface of the circuit board, and combined with the SMT soldering process, the axial packaging component and other patch type components are processed together in one time through the SMT soldering apparatus. The process steps are simple, production efficiency is improved and processing cost is reduced.