The invention provides a method and apparatus of detecting stress of packaging glue. The method of detecting stress of packaging glue includes the following steps: A1, providing a packaging support, amodel member for simulating heating of an LED chip, a metal adherent wire and packaging glue, wherein the model member is arranged on the packaging support through die bond; the metal adherent wire includes a copper wire and a silvered layer coated on the outer surface of the copper wire; the metal adherent wire is welded between the packaging support and the model member to enable the packagingsupport and the model member to form electric connection; and the packaging glue covers the model member and the member adherent wire; A2, connecting the packaging support with a power supply to enable the model member to work to simulate heating of the LED chip; A3, disconnecting the power supply to enable the model member to stop working and to be cooled to the room temperature; and A4, repeating the steps of A2 to A3, observing whether the metal adherent wire is blackened, and according to the shade of the blackened color, determining the magnitude of the stress of the packaging glue at theblackened position, wherein if the blackened color is deep relatively, the stress is larger, and if the blackened color is lighter or the metal adherent wire is not blackened, the stress is smaller.