The invention provides a chip packaging system which can reduce the thermal crosstalk between chips inside the package while enhancing the heat dissipation capability of a specific chip. The chip packaging system comprises a plurality of chips, a substrate, a heat dissipation assembly and at least one thermoelectric refrigeration sheet, wherein the heat dissipation assembly is provided with a heatdissipation ring and a heat dissipation cover, one end of the heat dissipation ring is fixed on the substrate, the other end, which is opposite to the end fixed on the substrate, of the heat dissipation ring is fixed on the heat dissipation cover and used for supporting the heat dissipation cover; the plurality of chips are arranged in a space enclosed by the substrate, the heat dissipation ringand the heat dissipation cover, and the plurality of chips are mutually separated by a heat insulation material or the air; and one side of each of the at least one thermoelectric refrigeration sheetis a hot end, and the other side is a cold end, the cold end of each thermoelectric refrigeration sheet is arranged at the side close to the plurality of chips and used for absorbing the heat of the chips, and the hot ends of each thermoelectric refrigeration sheet is used for leading out the heat absorbed by the cold ends.