The invention relates to the field of electronic element processing, and specifically relates to a cutting device for an electronic element. The device comprises a rack, a conveyor belt, a transferring plate, a collecting mechanism and a conveying cutting mechanism, wherein a cutting port is formed in a horizontal plate, and a chute is arranged on the lower surface of the horizontal plate; throughgrooves which intercommunicate are formed in the horizontal plate and an inclined plate; the collecting mechanism comprises a servo motor, a round roller, a pushing rod, a first spring, a first collecting frame and a second collecting frame; the conveying cutting mechanism comprises a conveying unit and a cutting unit; the cutting unit comprises a gear, a rack, a connecting rod and a quadrate cutter; the conveying unit comprises a conveying block, a conveying hook, a second spring and a pulling wire. According to the technical scheme, the device has the advantages that a circuit board can beregularly cut, and the circuit board and the wastes can be automatically separated without stopping the conveyor belt.