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发明授权
CN108231697B 用于芯片制造的光阻基板及芯片封装体 有权

用于芯片制造的光阻基板及芯片封装体
摘要：
本发明公开一种用于芯片制造的光阻基板及芯片封装体。所述光阻基板包括采用正向光阻形成的正向光阻层，所述正向光阻层上划分有多个小单元，所述多个小单元呈阵列排布，每一所述小单元用于包裹一颗芯片组件，其中，所述正向光阻层的位于相邻所述芯片组件之间的区域为可曝光及显影区域。基于此，本发明只需要对正向光阻层进行曝光处理及显影处理，相邻芯片之间的连接部分即可被去除，无需切割工艺即可实现各芯片之间的分离，有助于提升产品良率。
摘要（英）：

The invention discloses a light resistance substrate for manufacturing a chip and a chip packaging body. The light resistance substrate comprises forward light resistance layers formed by forward light resistors, wherein the forward light resistance layers are divided into multiple small units, the small units are distributed in an array manner, and each small unit is used for packaging a chip assembly; and regions of the forward light resistance layers between two adjacent chip assemblies are exposable and developable regions. According to the light resistance substrate, the connecting part between two chips can be removed by exposing and developing the forward light resistance layer, and the chips can be separated without a cutting process, so that the yield of products is increased.

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