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发明公开
CN108155876A 高频模块及通信装置 有权

高频模块及通信装置
摘要：
本发明提供包括多个放大电路并可进行高精度的温度补偿的高频模块及通信装置。高频模块包括：基板；设置在基板的第1区域中作为第1放大电路的低噪声放大电路；设置在基板的第2区域中作为第2放大电路的功率放大电路；以及作为设置在基板的第1区域与第2区域之间且发热性低于功率放大电路的组件的双工器，低噪声放大电路具有：生成依赖于第1二极管的温度特性的偏置电流(IBIAS)的偏置电路；生成依赖于第2二极管的温度特性的电压(VREF)以作为所述偏置电路的工作电压的电压生成电路；以及在由偏置电流(IBIAS)确定的工作点处工作的放大电路。
摘要（英）：

A radio-frequency module includes a substrate, a low-noise amplifier circuit being a first amplifier circuit arranged in a first area in the substrate, a power amplifier circuit being a second amplifier circuit arranged in a second area in the substrate, and a duplexer being a component arranged between the first area and the second area in the substrate and having a heat generating property lower than that of the power amplifier circuit. The low-noise amplifier circuit includes a bias circuit configured to generate a bias current dependent on temperature characteristics of a first diode, a voltage generating circuit configured to generate a voltage dependent on temperature characteristics of a second diode as an operating voltage for the bias circuit, and an amplifier circuit configured to operate at an operating point determined by the bias current.

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