An embodiment of the invention provides a laminate chip bead which includes a body on which a plurality of magnetic layers are laminated along a first direction; external electrodes configured on twoend faces in a second direction of the body which is vertical to the first direction; spiral coil electrodes configured on the magnetic layers; and a low-dielectric unit configured on at least a partbetween the coil electrodes and the external electrodes, and a dielectric constant is lower than that of the magnetic layers.