The invention discloses a fabrication method of a circuit board with buried blind holes. The fabrication method comprises the following steps of splitting the circuit board with the buried blind holesinto a sub-board group comprising at least two sub-boards according to conductive layers of the circuit board with the buried blind holes and structures of the buried blind holes, wherein the layersof the sub-boards in the sub-board groups are symmetrically arranged, and communication holes are formed in positions, corresponding to the buried blind holes, of the sub-boards; arranging a first insulation layer between two adjacent sub-boards if the two adjacent sub-boards are needed to be electrically connected, forming first bearing holes in positions, corresponding to the communication holes, of the first insulation layer, and filling conductive materials in the first bearing holes; arranging the first insulation layer between the two adjacent sub-boards if the two adjacent sub-boards are not needed to be electrically connected; and laminating each sub-board. According to the fabrication method of the circuit board with the buried blind holes, the sub-boards with layers symmetricallyarranged can be arranged during split design of the circuit board with the buried blind holes, the deformation of each sub-board is consistent during lamination, and warping and deformation are prevented.