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发明公开
CN107924204A 连续流体热界面材料施配 无效 - 撤回

连续流体热界面材料施配
摘要：
本发明揭示一种用于在电子装置的测试期间控制所述电子装置的温度的温度控制系统，其包含：热头，其具有装置接触面，所述装置接触面经配置以在测试期间与所述电子装置接触；流体热界面材料TIM施配器，其经配置以将流体TIM施配到所述电子装置的面与所述热头的所述装置接触面之间的位置；及流体TIM施配器控制器，其经配置以控制所述TIM施配器，使得所述TIM施配器在所述电子装置的测试循环期间施配所述流体TIM。
摘要（英）：

A temperature control system for controlling a temperature of an electronic device during testing of the electronic device includes a thermal head having a device contact face configured to contact the electronic device during testing; a fluidic thermal interface material (TIM) dispenser configured to dispense a fluidic TIM to a location between a face of the electronic device and the device contact face of the thermal head; and a fluidic TIM dispenser controller configured to control the TIM dispenser such that the TIM dispenser dispenses the fluidic TIM during a test cycle of the electronicdevice.

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