The invention discloses an electronic package insulating material and a preparation method thereof. The electronic package insulating material is prepared from the following components: furfural acetone formaldehyde resin, butyl epoxy oleate, carboxylated nitrile rubber, a ceramic powder, 2-chloro-4-aminophenol, polyoxyethylene monocetyl ether, silicone oil, piperazine-2-carboxylic acid salt, portland cement, PE wax, and 3-methyltetrahydrophthalic anhydride. The package insulating material provided by the present invention has the advantages of both ceramic materials and resin materials, and shows high thermal conductivity and a thermal expansion coefficient, and is very consistent with the requirements of the electronic field for packaging materials; and meanwhile, the preparation processof the package insulating materials is simple and the preparation temperature is low. The overall production cost is low and the insulating material can be widely used.