The present invention provides a manufacturing method of a six-layer circuit board and a six-layer circuit board. The method comprises the steps of: feeding: providing copper coated laminates; laser blind hole: employing laser to drill blind holes on the copper coated laminates; black hole: forming conductive carbon layers on hole walls of the blind holes; pattern transfer: coating surfaces of thecopper coated laminates with dry films; removal of part of the dry films: performing windowing and exposure of positions requiring electroplating; porefilling and electroplating: electroplating the positions where are windowed and exposed with one layer of copper, and performing metallization of the blind holes to obtain metallized blind holes; demoulding: removing the dry films remained on the copper coated laminates, and exposing a first copper foil and a second copper foil; rapid etching: etching the exposed first copper foil and second copper foil, and obtaining single-sided copper circuit boards and double-sided copper circuit boards; and lamination: respectively performing lamination and stacking of the four single-sided copper circuit boards to complete manufacturing of the six-layer circuit board. Compared to the prior art, according to the six-layer circuit board, the blind holes and the circuits are manufactured at the same time through porefilling and electroplating, and aprecision circuit with a small circuit distance and dense wiring can be manufactured.