A chip package structure is provided. The chip package structure includes a first chip, a second chip, and a third chip. The second chip is between the first chip and the third chip. The chip packagestructure includes a first molding layer surrounding the first chip. The chip package structure includes a second molding layer surrounding the second chip. The chip package structure includes a thirdmolding layer surrounding the third chip, the first molding layer, and the second molding layer.