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发明授权
CN107482099B 发光二极管封装结构 有权

发光二极管封装结构
摘要：
本发明公开了一种发光二极管封装结构，包括基板、设置于基板上且为形状互补的电极层与绝缘层、至少一发光单元及与绝缘层为一体成型的反射壳体。发光单元包括发光二极管芯片及封装于发光二极管芯片外表面的荧光胶体，发光二极管芯片安装于电极层与绝缘层上，荧光胶体与电极层呈间隔设置，并且荧光胶体与电极层间形成有3微米至10微米的缝隙。反射壳体设置于电极层与绝缘层上并充填缝隙，反射壳体包覆于发光单元的侧缘，反射壳体与发光单元各具有远离基板的顶平面，反射壳体的顶平面不高于发光单元的顶平面并且相距0至30微米。借此，避免发光二极管封装结构产生光形和亮度不良的问题。
摘要（英）：

An LED package structure includes a substrate (1), a circuit layer (2) and an insulating layer (4) both disposed on the substrate (1), a light-emitting unit (5), and a reflective housing (7) integrally formed with the insulating layer (4). The light-emitting unit (5) includes an LED chip (51) and a fluorescent body (52) encapsulating the LED chip (51). The light-emitting unit (5) is mounted on the insulating layer (4) and the circuit layer (2). The fluorescent body (52) of the light emitting unit is spaced apart from the circuit layer (2) with a gap (G) in a range of 3ˆ¼10µm. The reflective housing (7) is formed on the insulating layer (4) and the circuit layer (2) and is further filled within the gap (G). A top plane (71) of the reflective housing (7) arranged away from the substrate (1) is lower than or equal to that of the light-emitting unit (5), and a distance (D4) between the two top planes (71, 521) is in a range of 0ˆ¼30µm.

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