The invention discloses a polishing planeness control method and device of polishing equipment and the polishing equipment. The method comprises the following steps that corresponding polishing pressure is applied to multiple pressure application zones of a wafer processed by the polishing equipment to carry out polishing treatment; the polishing thickness of each pressure application zone in the multiple pressure application zones is acquired, and the polishing time is acquired; the actual removing rate of each pressure application zone is calculated according to the polishing thickness and the polishing time of each pressure application zone; the removing rate drift distance of each pressure application zone is calculated according to the actual removing rate and the corresponding base removing rate of each pressure application zone; and the falling point position of polishing liquid is adjusted according to the removing rate drift distance of each pressure application zone. According to the polishing planeness control method of the polishing equipment, the service cycle of a polishing pad can be prolonged, the use efficiency of the polishing equipment can be improved, the production cost can be reduced, the yield of the wafer can be increased, simpleness and effectiveness are achieved, and stability is high.