A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650 DEG C or greater, makes it possible to maintain sufficient strength and heat dissipation performance in the heat dissipation member after manufacture. This copper alloy sheet for a heat dissipation component contains Fe: 1.0-2.4 mass% and P: 0.005-0.1 mass%, the remainder being Cu and unavoidable impurities, has a 110 MPa or greater 0.2% proof stress after heating for 30 minutes at 850 DEG C followed by water-cooling and subsequent aging treatment, and has a conductivity of 50% IACS or greater. This copper alloy can further contain Zn: 2.0 mass% or less (not including 0 mass%) and/or Sn: 0.005-0.5 mass%.