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CN107393881B 具有集成的电感器的IC封装体 有权

具有集成的电感器的IC封装体
摘要：
在一个实施方式中，一种半导体封装体包括集成电路(IC)，所述集成电路附接到第一图案化导电载体的芯片焊盘区段，并且通过电连接器耦接到所述第一图案化导电载体的切换节点区段。此外，所述半导体封装体包括位于所述IC之上的第二图案化导电载体、位于所述第二图案化导电载体之上的磁性材料和位于所述磁性材料之上的第三图案化导电载体。所述第二图案化导电载体与所述第三图案化导电载体电耦接，以便在所述半导体封装体中形成集成的电感器的绕组。
摘要（英）：

In one implementation, a semiconductor package includes an integrated circuit (IC) attached to a die paddle segment of a first patterned conduct carrier and coupled to a switch node segment of the first patterned conductive carrier by an electrical connector. In addition, the semiconductor package includes a second patterned conductive carrier situated over the IC, a magnetic material situated over the second patterned conductive carrier, and a third patterned conductive carrier situated over the magnetic material. The second patterned conductive carrier and the third patterned conductive carrier are electrically coupled so as to form windings of an integrated inductor in the semiconductor package.

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