The present invention provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a metal sheet, a dielectric layer, a patterned wiring layer, a first chip, and a encapsulated colloid. Dielectric layer coated metal sheet. The dielectric layer has opposing first and second surfaces, at least a first opening on the first surface, and a second opening on the second surface. The metal sheet is located in the second opening and is exposed to the first surface and the second surface, respectively. The patterned line layer is disposed on the second surface. The first chip is disposed on the metal sheet, wherein the first chip is located in the second opening and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and covers the first chip and the patterned line layer. A method for fabricating a semiconductor package structure is proposed. The semiconductor package structure provided by the invention has a thin overall thickness and has a good heat dissipation effect.