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发明授权
CN107104091B 一种半埋入线路基板结构及其制造方法 有权 许可

一种半埋入线路基板结构及其制造方法
摘要：
本发明的一个实施例提供一种半埋入线路基板结构，包括：半固化基板；半埋入到所述半固化基板中的半埋入线路；其中，所述半埋入线路的第一面位于与所述线路同侧的所述半固化基板的表面之上，所述半埋入线路的与所述第一面相对的第二面位于与所述线路同侧的所述半固化基板的表面之下，所述半埋入线路的侧面的一部分位于所述线路同侧的所述半固化基板的表面之上，所述半埋入线路的侧面的另一部分被所述半固化基板包裹。
摘要（英）：

An embodiment of the present invention provides a semi-embedded circuit substrate structure, comprising: a semi-cured substrate, and a semi-embedded circuit disposed in the semi-cured substrate in a semi-embedded manner. A first face of the semi-embedded circuit is positioned above the surface of the semi-cured substrate which is located on the same side of the circuit, and a second face of the semi-embedded circuit, opposite to the first face, is positioned below the surface of the semi-cured substrate which is located on the same side of the circuit. A part of a side surface of the semi-embedded circuit is positioned above the surface of the semi-cured substrate which is located on the same side of the circuit, and the other part of the side surface of the semi-embedded circuit is wrapped by the semi-cured substrate.

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