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发明授权
CN107068593B 芯片转移方法及设备 失效 - 权利终止

芯片转移方法及设备
摘要：
本发明公开一种芯片转移方法及设备，属于芯片转移技术领域。芯片转移设备包括：对合组件和压合组件，对合组件用于分别与源基板的第一板面以及目标基板的第一板面接触，并控制源基板的第二板面和目标基板的第二板面相对设置；压合组件用于向源基板的第一板面和目标基板的第一板面施加压力，使源基板的第二板面上的芯片与目标基板的第二板面压合；其中，任一基板的第一板面和第二板面为相对的板面。本发明解决了芯片转移效率较低的问题，提高了转移效率。本发明用于芯片转移。
摘要（英）：

The invention discloses a chip transfer method and a device, and belongs to the technical field of chip transfer. The chip transfer device comprises a jointing component and a pressing component. The jointing component is used for contacting a first board surface of a source substrate and a first board surface of a target substrate and making a second board surface of the source substrate and a second board surface of the target substrate arranged oppositely. The pressing component is used for applying a pressure to the first board surface of the source substrate and the first board surface of the target substrate to press a chip on the second board surface of the source substrate onto the second board surface of the target substrate. The first board surface and the second board surface of either substrate are opposite to each other. The problem that the efficiency of chip transfer is low is solved, and the transfer efficiency is improved. The chip transfer method and the device are used for chip transfer.

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