The invention provides a method for hole metallization of a circuit board. Drilling is performed on the circuit board, meanwhile, a conductive polymeric membrane is attached onto a hole wall, and a new process of activation is further performed. By such the process, circuit drilling and hole wall metallization can be relatively and conveniently achieved, the damage to a substrate is small, and the processing accuracy is high; and by a mode of magnetron sputtering, the plating layer is good in adhesion performance, the process is simple and environment-friendly, and the method is suitably used for a material with a very smooth surface.