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发明授权
CN106611740B 衬底及其制造方法 有权 转让

衬底及其制造方法
摘要：
本发明提供了一种衬底及其制造方法，包括：提供辅助衬底和支撑衬底，所述辅助衬底上至少包括外延层及所述外延层之上的钝化层，所述支撑衬底上至少包括掩埋介质层；将所述辅助衬底键合到所述支撑衬底上；去除所述辅助衬底；进行化学机械平坦化CMP直至所述外延层达到指定厚度。由于该钝化层能有效保减小该外延层在键合过程中受到的损伤，避免外延层中产生大量的缺陷，提升利用该外延层制造器件的性能及可靠性。
摘要（英）：

The invention provides a substrate and a manufacturing method thereof. The manufacturing method comprises the following steps: providing an auxiliary substrate and a support substrate, wherein the auxiliary substrate at least comprises an epitaxial layer and a passivation layer on the epitaxial layer, and the support substrate at least comprises a buried dielectric layer; bonding the auxiliary substrate to the support substrate; removing the auxiliary substrate; and performing chemical-mechanical planarization (CMP) until the epitaxial layer reaches a specified thickness. Damage to the epitaxial layer in a bonding process can be lowered effectively through the passivation layer, so that a large quantity of defects generated in the epitaxial layer are overcome, and the performance and reliability of a device manufactured by the epitaxial layer are improved.

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