Disclose is a chip package having an adhesive protection piece compliantly attached on the chip sensing surface, comprising a substrate, a main chip disposed on the substrate, an adhesive protection piece covering the main chip and an encapsulant encapsulating the main chip. The main chip has a chip sensing surface facing to a direction away from the substrate and a connection terminal electrically connected to the substrate. The adhesive protection piece essentially consists of a pick-and-place sheet and a die-bonding layer. The encapsulant completely encapsulates the die-bonding layer without covering the external surface of the pick-and-place sheet. The adhesive protection piece is compliantly attached to the chip sensing surface by pick-and-place processes so that the die-bonding layer is attached to the chip sensing surface with a constant adhesive gap. Moreover, the external surface of the pick-and-place sheet is parallel to the chip sensing surface which is not affected by the horizontal deviation of the substrate to resolve the sensing distortion issue when a sensing chip is covered by an adhesive protection piece.