This direct exposure apparatus (100) performs pattern exposure by directly applying an exposure light beam (1b) to a film-like photosensitive resin (PP) retained in a substrate (B), and includes: a light source (1) that outputs the exposure light beam (1b); a base (2); displacement mechanisms (4a-4d) that are able to support the peripheral region of the lower surface of the substrate (B) and operate so as to displace the substrate (B) in the optical axis direction of the exposure light beam (1b); and a support member (7) that is able to support the central region of the lower surface of the substrate (B). The support member (7) is disposed above the base (2) such that the optical axis of the exposure light beam (1b) is orthogonal to the upper surface of the support member (7) in a state where the substrate (B) is displaced by the displacement mechanisms (4a-4d) to bring the upper surface of the support member (7) and the central region of the lower surface of the substrate (B) into contact with each other.