The invention provides a thermoelectric cooling module which is used for bearing a heat source device and controlling the temperature of the heat source device. The thermoelectric cooling module comprises a first base plate, a second base plate opposite to the first base plate and a plurality of pairs of first prime submodules. The first base plate is used for bearing the heat source device, a containing space is formed between the first base plate and the second base plate, and the multiple pairs of first prime submodules are arranged in the containing space in a spaced manner and are all connected with the first base plate and the second base plate. The multiple pairs of first prime submodules are connected with an external power source so as to change the voltage or the electric current to adjust the temperature difference between the first base plate and the second base plate so that the temperature of the heat source device can be controlled. The containing space comprises a first region and a second region adjacent to the first region, the first region is arranged corresponding to the heat source device, and density of the first prime submodules in the first region is larger than that of the first prime submodules in the second region.