The invention relates to a wafer processing apparatus, and more particularly, to a wafer metal-stripping and photoresist-stripping cleaning device comprising a soaking unit, a centering box unit, a photoresist-stripping unit, a cleaning unit, a robot and a working table. The robot is disposed at the central portion of the working table. The respective units are arranged around the robot. The photoresist-stripping unit and the cleaning unit, which are arranged at the same side of the robot, are arranged in a stacking manner. A wafer is sequentially sent to the respective units through the robot. The photoresist-stripping unit comprises a photoresist-stripping chamber, a photoresist-stripping arm, a photoresist-stripping clamping tray and a photoresist-stripping arm moving mechanism. The photoresist-stripping clamping tray is disposed in the photoresist-stripping chamber. The photoresist-stripping arm is mounted on the photoresist-stripping moving mechanism. The photoresist-stripping arm is equipped with a high pressure photoresist-stripping liquid nozzle and a constant pressure photoresist-stripping liquid nozzle thereon. The photoresist-stripping chamber is provided internally with a metal recovery pipeline and a photoresist-stripping solution recovery pipeline. The outer side of the photoresist-stripping chamber is provided with an exhaust interface. The invention realizes the automatic metal-stripping and photoresist-stripping of the wafer, and can reduce the photoresist and metal residues, improve the efficiency of metal recovery and save the enterprise cost.