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发明公开
CN106373898A 半导体器件及其封装方法 无效 - 撤回

半导体器件及其封装方法
摘要：
本发明公开了封装的半导体器件及其封装方法。在一些实施例中，封装半导体器件的方法包括将第一衬底封装至膜。将膜的第一部分附接至第一衬底的第一区域并且将膜的第二部分附接至第一衬底的第二区域。方法还包括将膜的第一部分与膜的第二部分分离。
摘要（英）：

Packaged semiconductor devices and methods of packaging thereof are disclosed. In some embodiments, a method of packaging semiconductor devices comprises attaching a first substrate to a film. A first portion of the film is attached to a first region of the first substrate and a second portion of the film is attached to a second region of the first substrate. The method further comprises separating the first portion of the film from the second portion of the film.

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