The invention relates to a solder ball particle and a preparation method and application thereof. Under the inert gas atmosphere, lead-free solder is heated so that a raw material can be molten, and an alloy solution is sufficiently stirred; under the inert gas atmosphere, the alloy solution is prepared into an alloy liquid drop; inert gas flow is indirectly cooled through liquid, the alloy liquid drop is condensed at the temperature ranging from -190 DEG C to -10 DEG C, and stabilization processing is conducted for 1 days to 3 days at the temperature ranging from 0 DEG C to 15 DEG C in the inert atmosphere being 20 RH% to 40 RH%; and component detection is conducted, and the prepared solder ball particle can be applied in BGA packaging. Compared with the prior art, the preparation method is simple in preparation process and suitable for large-scale production. The solder ball particle is stable in component content, good in quality and not likely to become black, and the surface is free of the oxidation phenomenon.