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CN106105412B 用于电子设备的多层散热装置 有权

用于电子设备的多层散热装置
摘要：
一些实现提供了包括第一扩热器层、第一支承结构、和第二扩热器层的多层散热器件。第一扩热器层包括第一扩热器表面和第二扩热器表面。第一支承结构包括第一支承表面和第二支承表面。第一支承结构的第一支承表面耦合到第一扩热器的第二扩热器表面。第二扩热器层包括第三扩热器表面和第四扩热器表面。第二扩热器层的第三扩热器表面耦合到第一支承结构的第二支承表面。在一些实现中，第一支承结构是导热粘合层。在一些实现中，第一扩热器层具有第一导热率，而第一支承结构具有第二导热率。
摘要（英）：

Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

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