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发明公开
CN106024653A 半导体器件制造方法 有权

半导体器件制造方法
摘要：
在半导体器件的组装中的导线键合中，通过作为键合工具的楔形件将Al线耦合到引线区段，之后，将楔形件从引线区段的顶部退出，并且刀具被降下并使Al线在这种状态下被切断。在随着刀具的降下而同时降下的止挡件已撞击引线区段这一时间点停止刀具的降下，并且通过刀具降下的停止而终止Al线的切割。
摘要（英）：

In wire bonding in assembling of a semiconductor device, an Al wire is coupled to a lead section by a wedge which is a bonding tool, thereafter, the wedge is withdrawn from the top of the lead section and a cutter is lowered and the Al wire is cut off in this state. Lowering of the cutter is stopped at a point in time that a stopper which is lowered simultaneously with lowering of the cutter has truck against the lead section and cutting of the Al wire is terminated by stopping of lowering of the cutter.

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