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发明授权
CN105908002B 一种金合金键合丝及其制造方法 有权

一种金合金键合丝及其制造方法
摘要：
一种金合金键合丝，其特征在于按重量计含有：钯1－1.5%，银20－24%，钙、铍和铈中的一种和其中多种的组合2－200 ppm，余量为金。本发明还提供上述金合金键合丝的一种制造方法。本发明的金合金键合丝可用于IC、LED封装中，综合打线性能优异，具体体现在：热影响区长度小（可达到53－60 um），极大地降低了打线的弧高；烧球性能好，在FAB烧球后得到数目适中的对称柱状晶，变形球真圆度高；封装后产品热冲击性能好，可靠性高。
摘要（英）：

A gold alloy bonding wire comprises, by weight, 1-1.5% of palladium, 20-24% of silver, 2-200ppm of one or a combination comprising two or more of calcium, beryllium and cerium, and the balance of gold. The invention also provides a manufacturing method of the gold alloy bonding wire. The gold alloy bonding wire can be used in IC and LED packaging, and has excellent integral wiring performances, and the excellent integral wiring performances are characterized in that the length of heated affected zone is small (can reach 53-60[mu]m), and the wiring camber is greatly reduced; the performances of ignition balls are good, a moderate quantity of symmetric cylindrical crystals are obtained after FAB ball ignition, and the roundness of deformed balls is high; and packaged products have good heat shock resistance and high reliability.

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