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发明公开
CN105849900A 用于处理引线框表面的方法及具有经处理的引线框表面的装置 无效 - 撤回

用于处理引线框表面的方法及具有经处理的引线框表面的装置
摘要：
本发明揭示一种用于制造集成电路装置的方法。提供引线框，其具有经配置以接纳集成电路裸片的裸片支撑区域及与所述裸片支撑区域相邻的多个引线框指状件，每一引线框指状件包含所述引线框指状件的一端处的指状件尖端区域。所述引线框经遮蔽使得所述引线框的一或多个区域被覆盖且所述引线框的一或多个区域暴露，其中针对每一引线框指状件，所述相应指状件尖端区域的第一区由所述遮蔽覆盖且所述相应指状件尖端区域的第二区暴露。将所述引线框的所述一或多个暴露区域镀银，使得针对每一引线框指状件，所述相应指状件尖端区域的所述第二区镀银且所述相应指状件尖端区域的所述第一区不镀银。
摘要（英）：

A method for manufacturing an integrated circuit device is disclosed. A leadframe is provided having a die support area configured to receive an integrated circuit die and a plurality of leadframe fingers adjacent the die support area, each leadframe finger including a finger tip area at one end of the leadframe finger. The leadframe is masked such that one or more areas of the leadframe are covered and one or more areas of the leadframe are exposed, wherein for each leadframe finger, a first region of the respective finger tip area is covered by the masking and a second region of the respective finger tip area is exposed. The one or more exposed areas of the leadframe are silver plated such for each leadframe finger, the second region of the respective finger tip area is sliver plated and the first region of the respective finger tip area is not sliver plated.

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