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发明授权
CN105829478B 用于粘结半导体的粘合剂树脂组合物和用于半导体的粘合剂膜 有权

用于粘结半导体的粘合剂树脂组合物和用于半导体的粘合剂膜
摘要：
本发明涉及一种用于粘结半导体的粘合剂树脂组合物，其包含：(甲基)丙烯酸酯基树脂，其包含大于17重量％的(甲基)丙烯酸酯基重复单元，所述(甲基)丙烯酸酯基重复单元含有环氧基官能团；环氧树脂，其具有大于70℃的软化点；和酚醛树脂，其具有大于105℃的软化点，其中(甲基)丙烯酸酯基树脂的重量比例为0.48至0.65，相对于(甲基)丙烯酸酯基树脂、环氧树脂和酚醛树脂的总重量计；还涉及一种由树脂组合物获得的用于半导体的粘合剂膜；一种包括粘合剂层的切割模片粘结膜，所述粘合剂层包含用于半导体的粘合剂膜；一种包括切割模片粘结膜的半导体晶片；以及，一种使用切割模片粘结膜切割半导体晶片的方法。
摘要（英）：

The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C; and a phenol resin having a softening point of more than 105° C, wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

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