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发明授权
CN105712089B 一种无接触输运与定位平台装置的控制方法 有权 转让

一种无接触输运与定位平台装置的控制方法
摘要：
本发明公开了一种无接触输运与定位平台装置及控制方法，该装置包括运输平台、位于运输平台下方的固定平台和位于固定平台下方的基座，所述固定平台通过固定平台支撑与基座连接，所述运输平台上设有若干个凹槽，每个凹槽设有进气孔和出气孔，所述进气孔与进气软管连接，进气软管与正压气源连接，所述出气孔与出气软管连接，出气软管与负压气源连接。本发明的一种无接触输运与定位平台装置，由于空气在凹槽内呈水平流动状态，因此，可以最大程度地利用气流粘性力驱动工件运动，获得较大的运动加速度，这可以实现真正意义上的完全无接触，气流与半导体工件接触时不易产生静电污染，接触点附近不易导致应力集中。
摘要（英）：

The invention discloses a non-contact transporting and positioning platform device and a control method. The device comprises a transporting platform, a fixing platform located below the transporting platform, and a base located below the fixing platform. The fixing platform is connected with the base through a fixing platform support. The transporting platform is provided with a plurality of grooves. Each groove is provided with an air inlet hole and an air outlet hole. Each air outlet hole is connected with an air inlet hose. Each air inlet hose is connected with a positive-pressure air source. Each air outlet hole is connected with an air outlet hose, and each air outlet hose is connected with a negative-pressure air source. According to the non-contact transporting and positioning platform device, due to the fact that air is in a horizontal flowing state in the grooves, the airflow viscosity force can be utilized to the maximum degree to drive a workpiece to move, the high motion acceleration is obtained, and complete non-contact can be truly achieved. When airflow makes contact with the semiconductor workpiece, static pollution is not likely to be generated, and stress concentration is not likely to be caused near a contact point.

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