A semiconductor device and a method of making the same. The semiconductor device includes a semiconductor substrate (70) mounted on a carrier. The semiconductor substrate includes a Schottky diode. The Schottky diode has an anode (58) and a cathode (56). The semiconductor device also includes one or more bond wires (66) connecting the cathode (56) to a first electrically conductive portion (52A) of the carrier. The semiconductor device further includes one or more bond wires (68) connecting the anode (58) to a second electrically conductive portion (52B) of the carrier. The first electrically conductive portion (52A) of the carrier is electrically isolated from the second electrically conductive portion (52B) of the carrier. The first electrically conductive portion (52A) of the carrier is configured to provide shielding against electromagnetic interference associated with switching of the anode (58) during operation of the device. Both the cathode (56) and the first electrically conductive portion (52A) of the carrier are electrically isolated from a backside of the semiconductor substrate (70).