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发明公开
CN105647090A 一种高熔点导热电子材料及其制备方法 无效 - 撤回

一种高熔点导热电子材料及其制备方法
摘要：
本发明公开了一种高熔点导热电子材料，包括如下重量份数的成分：ACS树脂30-40份、富马酸树脂15-25份、二氧化钛1-3份、碳酸锌2-5份、苯磺唑酮0.5-3份、9-亚芴基乙酸乙酯10-13份、铜铍合金棒1-3份、硫氰化亚镁1-4份、1-丁烷硫醇锌0.5-2.5份、酞酸二壬酯8-14份、三油酸山梨酯9-15份、硅噻菌胺3-7份、叶醇缩醛15-20份。该电子材料具备较高的熔点和良好的导热性能，能够更好的适应现有电子元器件。
摘要（英）：

The invention discloses a high-melting-point heat-conducting electronic material which comprises the following components in parts by weight: 30-40 parts of ACS (acrylonitrile-chlorinated polyethylene-styrene) resin, 15-25 parts of fumaric acid resin, 1-3 parts of titanium dioxide, 2-5 parts of zinc carbonate, 0.5-3 parts of sulfinpyrazone, 10-13 parts of ethyl 9-fluorenylidene acetate, 1-3 parts of copper-beryllium alloy bar, 1-4 parts of magnesium thiocyanide, 0.5-2.5 parts of 1-butanethiol zinc, 8-14 parts of dinona phthalate, 9-15 parts of sorbitan trioleate, 3-7 parts of silthiopham and 15-20 parts of leaf acetal. The electronic material has the advantages of higher melting point and favorable heat-conducting property, and can better adapt to the existing electronic components.

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