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发明授权
CN105590919B 电路壳体 有权

电路壳体
摘要：
本发明涉及一种电路壳体，其具有带有单片集成的第一电路的第一半导体本体，其中，第一电路包括与键合面连接的第一信号输出端和与键合面连接的第一信号输入端，并且电路壳体还具有带有单片集成的第二电路的第二半导体本体，其中，第二电路包括与键合面连接的第二信号输出端和与键合面连接的第二信号输入端，并且电路壳体也具有带有至少一个键合面的接通元件，并且电路壳体还具有载体元件，其中，第一信号输出端的键合面和第二信号输入端的键合面与接通元件连接，从而在第一信号输出端和第二信号输入端之间存在电连接并且接通元件的一部分穿过电路壳体。
摘要（英）：

A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.

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