The invention discloses a circuit board machining method, and the method comprises the steps: milling a groove at a position, at which a copper block is implanted in advance, on a circuit board, wherein the number of the groove is not less than one; disposing resin at the bottom of the groove; disposing copper slurry on the resin; implanting the copper block into the groove, and enabling the resin and the copper slurry to be solidified; and carrying out the electroless plating copper and electroplating of the circuit board. The embodiment of the invention also provides the circuit board. According to the embodiment of the invention, the method and circuit board are used for solving a problem of wiring space waste in the prior art.