The invention discloses a laminated circuit board processing method and a laminated circuit board in order to improve the bonding force between the layers of a circuit board after lamination and avoid layering and cracking to some extent. According to some feasible embodiments of the invention, the laminated circuit board processing method comprises the following steps: providing a first laminated board which is provided with a circuit pattern on the surface; arranging liquid resin covering the circuit pattern completely on the surface of the first laminated board; coarsening and curing the liquid resin into solid resin with a rough surface; stacking a prepreg on the rough surface of the solid resin, and stacking a metal layer or a second laminated board on the surface of the prepreg; and performing laminating to make a needed laminated circuit board.