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发明授权
CN105161436B 倒装芯片的封装方法 有权 转让

倒装芯片的封装方法
摘要：
本发明公开了一种倒装芯片的封装方法，包括：在倒装芯片的电极表面和封装基板的表面同时电铸金属，实现倒装芯片的电极和封装基板之间通过金属连接。具体包括：S1、在倒装芯片周围设置封装基板；S2、在倒装芯片的电极表面和封装基板的表面镀金属导电膜；S3、在金属导电膜的表面涂覆光刻胶；S4、在光刻机上将光刻板上的电极结构与倒装芯片的电极结构对准并进行光刻，获得光刻胶结构模，并使得电极之间的绝缘部位覆盖光刻胶；S5、将金属导电膜作为电极，在光刻胶结构模内电铸金属，使得光刻胶结构模内长满金属；S6、去除覆盖在绝缘部位的光刻胶及光刻胶覆盖的金属导电膜。本发明利用电铸和光刻技术，简化工艺，提高生产效率。
摘要（英）：

An encapsulation method for a flip chip that includes electroforming metal on an electrode surface of a flip chip and a surface of an encapsulation substrate simultaneously. The encapsulation method specifically includes setting an encapsulation substrate around a flip chip; plating a metal conducting film on an electrode surface of the flip chip and a surface of the encapsulation substrate; coating a photoresist on a surface of the metal conducting film; aligning and photoetching an electrode structure on a photoetching plate and an electrode structure of the flip chip, and covering an insulating part between electrodes with the photoresist; taking the metal conducting film as the electrode, electroforming metal inside the photoresist structural model; and removing the photoresist covering the insulating part and removing the metal conducting film. The encapsulation method adopts electroforming and photoetching technology, and thus the process is simplified and the production efficiency is improved.

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