In this printed circuit board (3) with an integrated coil, conductive coil patterns (4a through 4e) are formed on a plurality of layers (L1 through L3) and conductive heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are provided on a bottom outer layer (L3) so as to correspond to coil patterns (4a through 4d) on a top outer layer (L1) and an inner layer (L2). Each heat-dissipating pattern (5a7 through 5a9, 5b7 through 5b9) is kept separate from the other heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) and the coil pattern (4e) on the bottom outer layer (L3). Corresponding coil patterns (4a through 4d) and heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are connected by conductive heat-dissipating pins (7a through 7f), pads (8c), and through-holes (8).