The invention discloses an encapsulation method of a ceramic thermosensitive resistor. The encapsulation method comprises the following steps of: carrying out first encapsulation, second encapsulation and curing by using a wet dip-coating method, wherein the ceramic thermosensitive resistor is subjected to first rotation after the first encapsulation, the ceramic thermosensitive resistor is subjected to second rotation after the second encapsulation, and the rotation planes of the first rotation and the second rotation are parallel to a gravity direction. The ceramic thermosensitive resistor encapsulated according to the method is uniform in the thickness of an encapsulation layer, and the passing rate of electric performance test is improved.