The chuck for aligning a first planar substrate, e.g. a wafer, in parallel to a second planar substrate, e.g. a mask, comprises: a top plate having a top surface for arrangement of the first planar substrate, a bottom plate, at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between a first planar substrate, e.g. a wafer, on a top plate of a chuck, and a second planar substrate, e.g. a mask, in particular by means of the chuck comprises the steps of measuring the thickness of the first planar substrate at at least one point; measuring the distance between a surface of the second planar substrate and the top surface of the top plate by at least one distance measuring sensor of the chuck; and adjusting the tilt between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck, preferably in combination with at least three spring bearings of the chuck.