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发明公开
CN104885202A 切割片用基材膜及具备该基材膜的切割片 失效 - 权利终止

切割片用基材膜及具备该基材膜的切割片
摘要：
本发明提供一种切割片用基材膜，可不赋予电子线或γ线等的物理能量，在全切过程中有效地减少被切断物在切割时产生的切割屑，作为在扩展步骤中具有优异伸长性的切割片用基材膜，为具备树脂层(A)的切割片用基材膜(2)，树脂层(A)提供含有聚乙烯和乙烯-四环十二烯共聚物的基材膜(2)，同时提供具备所述切割用基材膜的切割片。
摘要（英）：

The present invention provides a substrate film (2) for a dicing sheet provided with a resin layer (A), as a substrate film for a dicing sheet having excellent extension in an expansion step, suppressing the occurrence of dicing debris occurring when dicing an object to be cut during full-cut dicing without applying physical energy such as an electron beam or a [gamma] beam or the like, the resin layer (A) containing polyethylene and an ethylene-tetracyclododecene copolymer; and a dicing sheet provided with the substrate film for a dicing sheet.

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