The invention discloses a circuit board electroplating method, aiming to overcome the defects of an existing graphic pre-gold-plating technology and an existing local gold-plating technology by a thin-copper method. The circuit board electroplating method is used for processing circuit boards with requirements on high-density circuits and high-precision size. The circuit board electroplating method includes the steps of processing a surface metal layer on a circuit board to a circuit layer; etching and thinning a non-electroplating area of the circuit layer; arranging insulating media in the etched and thinned non-electroplating area; electroplating an electroplating area of the circuit layer.